The HiSilicon K3V2 quadcore processor independently designed by Huawei has a main frequency of up to 1.2GHz/1.5GHz. The K3V2 quadcore processor has a specification of 12 * 12mm, which is currently the smallest quadcore processor in the industry. At the same time, the K3V2 quadcore processor is equipped with the industry's strongest embedded GPU and adopts the high-end 64bit bandwidth DDR memory design in mobile phone chips to fully unleash the performance of the quadcore.

It is reported that this high-performance CPU is independently designed by Haisi (a subsidiary of Huawei) and adopts a 35nm ARM architecture. The Haisi K3V2 is a two-year work product of Huawei's chip department, with a main frequency of 1.2GHz and 1.5GHz, respectively. The official claim is that this chip can surpass Tegra 3 performance by 30% to 50% in a series of benchmark tests.

According to the chief architect of Huawei's chip division, the HiSilicon K3V2 chip uses a 64 bit memory bus, twice the size of the Tegra 3 memory bus, which is one of the main reasons for the performance improvement of the K3V2 chip. This chip is produced by TSMC using a 40 nanometer process, with a chip area of 12x12mm. Huawei also stated that the company will sell this processor chip to other companies.

The HiSilicon K3V2 uses a quad core ARM Cortex A9 and a built-in 16 core graphics chip. The graphics card was jointly developed by Huawei and an unnamed American chip design company. The two companies have jointly developed the architecture of graphics cards, with American partners responsible for specific applications.

The graphics card chip can handle both 2D and 3D, with a video processing capability of 35f/s. According to Huawei's testing, the video processing capability of the Tegra 3 is 13 fps, while the dual core Qualcomm processor is 8.4 fps.